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Two electrical engineering graduate college students took house prime prizes from a world analysis competitors.
Riya Paul and Affan Abbasi earned the most effective presentation and greatest poster awards, respectively, on the Worldwide Microelectronics Meeting and Packaging Society (iMAPS) 53rd Symposium on Microelectronics. The scholars had been honored for his or her work to make digital units extra compact and environment friendly.
iMAPS is taken into account “the most important society devoted to the development and progress of microelectronics and electronics packaging applied sciences by skilled schooling,” in line with the society’s web site. The 2020 worldwide symposium was held on-line due to COVID-19.
Paul obtained first place within the iMAPS 2020 Symposium Finest Scholar Presentation competitors for her work on the thermal advantages of utilizing the novel materials thermal pyrolytic graphite, often known as TPG.
“TPG has a particularly excessive in-plane thermal conductivity, which directs the warmth generated by the high-power units in the direction of the facility module cooling techniques,” Paul mentioned. “It reduces the junction temperature, so the facility density could be additional elevated. In day-to-day purposes, the sizes of the facility modules and therefore the top purposes just like the inverter’s quantity will scale back.”
Paul used each simulations and experimental evaluation to check samples of the distinctive materials as a part of her examine.
Abbasi earned first place within the iMAPS 2020 Symposium Finest Scholar Poster competitors for his work on a gate driver design in state-of-the-art Silicon Carbide 1 µm CMOS expertise node and integrating it contained in the industrial energy module to extend the facility density.
“The sort of analysis would assist firms make compact energy techniques with higher effectivity,” he mentioned. “For instance, for an electrical automobile, you may have a big energy system with higher effectivity, however it might be large, and that weight would add to the general weight of the automobile. And because of the large overhead, the general efficiency of the car would degrade.”
Affan mentioned his analysis may scale back the associated fee and space consumption. His work was performed beneath the ARPAe CIRCUITS program.
Paul mentioned her analysis has broad implications.
“The work performed right here is new and has super operational advantages for the facility module packaging builders for quite a few purposes like motor drives,” Paul mentioned. “So, it was vital to publish it for additional work on it.”
Paul mentioned she’s grateful to Fang Luo, her former mentor and advisor, and her colleague Amol Deshpande and Wei Fan, from TPG provider Momentive, for his or her help and encouragement towards publishing her work.
Affan mentioned the award meant so much to him, and he is excited for the longer term.
“This award confirms that I’m doing good work,” he mentioned. Affan mentioned he is grateful to Asif Khandoker for his assist in the presentation.
To study extra concerning the Worldwide Microelectronics Meeting and Packaging Society’s 53rd Symposium on Microelectronics, visit the group’s website.
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